From wh6p at cms.mail.virginia.edu  Fri May 16 08:38:28 2008
From: wh6p at cms.mail.virginia.edu (Wei Huang)
Date: Fri, 16 May 2008 11:38:28 -0400
Subject: [Hotspot] (Experimental Post) Broadcom Position - HotSpot Thermal
 Simulator (fwd)
Message-ID: <D357AEDA15048FCA7C2D91A8@mstu2>

Dear HotSpot subscribers,

This post is about a HotSpot-related position in Broadcom. 
Since the majority of this mailing list are grad students, 
I guess this information might be of interest to some of 
us. Please directly contact Mr. Greg Hauser regarding this 
job.

Please notice this is experimental, and we welcome feedback 
on whether targeted job postings, moderated by us, are 
appreciated.

-Wei Huang


---------- Forwarded Message ----------
Date: Thursday, May 15, 2008 1:25 PM -0700
From: Greg Hauser <ghauser at broadcom.com>
To: Wei Huang <wh6p at cms.mail.virginia.edu>
Subject: RE: Broadcom Position - HotSpot Thermal Simulator

Hi Wei,

Thank you for the email.  I've attached the position
description to this email.  I look forward to the response
from the group!

Title: Engineer, Staff Packaging

*IC package thermal modeling, thermal design, thermal
characterization, and technology development *Electronic
system thermal modeling, thermal design, and form-factor
thermal evaluation *Perform product verification and
customer application system thermal tests *Technical
support to internal and external customers *Generate
product thermal specifications. Generate product thermal
application notes *Maintain product thermal database

Requirements:
*Advanced degrees (MS or Ph.D.) with major in
thermal-fluids science *Experience in computational fluid
dynamics (CFD) and computational heat transfer. Advanced
knowledge and work experience with numerical methods in
engineering and mathematics *Minimum 3+ year experience in
Icepak modeling of electronic components and electronic
systems *Experience with thermocouple, IR, and other
methods for IC package temperature characterization
*Experience in package/board/system level thermal design,
thermal modeling, and cooling technologies *Theory and
experience in TIM for electronic applications *Basic
understanding of electronic circuits and IC packaging
technologies *Educational background in electronic package
design, package environmental tests, and packaging materials
*Basic understanding of electronic device reliability tests
*Strong communication skills
*Strong analytical and organizational skills; attention to
details in engineering analysis and project management

Regards,

Greg Hauser
Corporate Recruiter
Corporate SG&A / Manufacturing Operations / QA
Broadcom Corporation
(949) 926-7679
ghauser at broadcom.com
www.broadcom.com




From lymanblue at gmail.com  Thu May 29 10:42:08 2008
From: lymanblue at gmail.com (=?BIG5?B?qky4zrBW?=)
Date: Fri, 30 May 2008 01:42:08 +0800
Subject: [Hotspot] The power trace input file for HotSpot
Message-ID: <2b8513b80805291042h57e125b1i9be60e7acb69d043@mail.gmail.com>

Hi,

I am new to use HotSpot, and I have a basic question.
I try to generate the power trace input file for HotSpot.
But the -ptrace option in Wattch doesn't generate the power trace for HotSpot.

Could someone give me a full example to generate the power trace file
for HotSpot?
Thank you very much.

best regards.

-- 
Yu-Hsun Lin  ???
System Software Lab, CS, NTHU, Taiwan