From wh6p at cms.mail.virginia.edu  Thu Jun 25 11:36:32 2009
From: wh6p at cms.mail.virginia.edu (Wei Huang)
Date: Thu, 25 Jun 2009 14:36:32 -0400
Subject: [Hotspot] Fwd: A question of HotSpot
In-Reply-To: <f3dbca5f0906251110r4af94eebgdf3292a23510882c@mail.gmail.com>
References: <f3dbca5f0906251043m7ccc1c0fi8195f1bf9a600afd@mai l.gmail.com>
	<f3dbca5f0906251110r4af94eebgdf3292a23510882c@mail.gmail.com>
Message-ID: <3635F868C609BDCD9D4098C8@mstu1>

Hi

As listed in the sample layer.lcf file, Layer 0 silicon is 
the furthest to heatsink. The relative positions of all 
layers are something like this:

Air
Sink
Spreader
TIM N
Chip N
TIM N-1
Chip N-1
....
TIM 0 (Layer 1)
Chip0 (Layer 0)

Hope this helps.

-Wei

--On Friday, June 26, 2009 2:10 AM +0800 
"=?Big5?B?vEKxb6Z0?=" <red921533 at gmail.com> wrote:

> Hi,
>
> I use the newest HotSpot to compute temperature for 3D
> ICs, but I have a question about the layer number of
> HotSpot in 3D ICs. What is the layer number of the
> silicon layer which is closest to heatsink? Is it 1?
> What is the layer number of the thermal inerface material
> layer which is closest to heatsink? Is it 0?
>
> Best regards,
>
> De-Yu Liu