From wh6p at virginia.edu  Wed Jan  5 07:45:03 2011
From: wh6p at virginia.edu (Wei Huang)
Date: Wed, 5 Jan 2011 09:45:03 -0600
Subject: [Hotspot] Remove Heat Sink and Heat Spreader
In-Reply-To: <AANLkTi=g64fnEZwMWPkfUmu7L3oVBotxYPRzerGK=4kZ@mail.gmail.com>
References: <AANLkTi=g64fnEZwMWPkfUmu7L3oVBotxYPRzerGK=4kZ@mail.gmail.com>
Message-ID: <AANLkTim6s5LrsQ+dKmz5dMRyW6fXV19p7W5zs3Oph5-w@mail.gmail.com>

There is no easy way to completely remove spreader and sink. What you can do
to approximate that is to use very thin layer thicknesses (10's of microns
maybe), such that the effects of them are negligible.

-Wei

On Sun, Dec 26, 2010 at 5:50 AM, Amin Ezhdehakosh <
amin.ezhdehakosh at gmail.com> wrote:

> Hi,
> How can I remove Heatsink and HeatSpreader in HotSpot?
>
> --
> Regards,
> Amin Ezhdehakosh
>
> _______________________________________________
> HotSpot mailing list
> HotSpot at mail.cs.virginia.edu
> http://www.cs.virginia.edu/mailman/listinfo/hotspot
>
>
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From soartang at gmail.com  Wed Jan  5 08:47:53 2011
From: soartang at gmail.com (Aoxiang Tang)
Date: Wed, 5 Jan 2011 11:47:53 -0500
Subject: [Hotspot] bonding technique
Message-ID: <AANLkTimuGdXSG7MD+fr4RcrVqM0uHDhS_rL9dgFv_Bb1@mail.gmail.com>

Hi hotspot,

I have several questions about the 3D architecture that HOTSPOT uses.
What's the bonding technique of the 3D architecture? I mean how are the
layers are connected? facet-to-face or face-to-back? What's the material of
the TIM?
Are there any papers of HOTSPOT talking about the 3D architecture in detail
so that I can check the information myself? I don't find the information in
the papers listed on line.

Thank you!

best
Aoxiang
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From wh6p at virginia.edu  Wed Jan  5 14:32:51 2011
From: wh6p at virginia.edu (Wei Huang)
Date: Wed, 5 Jan 2011 16:32:51 -0600
Subject: [Hotspot] bonding technique
In-Reply-To: <AANLkTimuGdXSG7MD+fr4RcrVqM0uHDhS_rL9dgFv_Bb1@mail.gmail.com>
References: <AANLkTimuGdXSG7MD+fr4RcrVqM0uHDhS_rL9dgFv_Bb1@mail.gmail.com>
Message-ID: <AANLkTi=Wi5a=Ue5Dxha_DWc1xfjZ_oFRoj3SyUybgDRA@mail.gmail.com>

Hi,

Right now, the way HotSpot models 3D stacks is more like face-to-back, that
is, HotSpot assumes heat source in one layer first conducts through some
thickness before reaching another layer. But in reality, since silicon is
really thinfor the sandwiched layers and there are TIMs between layers, its
impact on modeling face-to-face thermal behavior would be minor. As for the
TIM material properties, we don't have authoritative data. either. But I
guess a search in 3D literature should yield some data.

-Wei

On Wed, Jan 5, 2011 at 10:47 AM, Aoxiang Tang <soartang at gmail.com> wrote:

> Hi hotspot,
>
> I have several questions about the 3D architecture that HOTSPOT uses.
> What's the bonding technique of the 3D architecture? I mean how are the
> layers are connected? facet-to-face or face-to-back? What's the material of
> the TIM?
> Are there any papers of HOTSPOT talking about the 3D architecture in detail
> so that I can check the information myself? I don't find the information in
> the papers listed on line.
>
> Thank you!
>
> best
> Aoxiang
>
> _______________________________________________
> HotSpot mailing list
> HotSpot at mail.cs.virginia.edu
> http://www.cs.virginia.edu/mailman/listinfo/hotspot
>
>
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From yew002 at ucsd.edu  Sun Jan 16 10:56:51 2011
From: yew002 at ucsd.edu (Yen-Kuan Wu)
Date: Sun, 16 Jan 2011 10:56:51 -0800
Subject: [Hotspot] Question about Secondary path feature
Message-ID: <AANLkTinHULAGaiVrunKi_j9jqvy7F1xNE6Fhmvc61KK-@mail.gmail.com>

Hello,

I am using HotSpot 5.0 and trying to simulate the heat transfer from
the PCB to ambient. However, I found that in my experiment, the
transient temperature can never reach to the steady state temperature
for a fairly long simulation time.

In my experiment, I used 10ms for the sampling interval and simulated
for a power trance has 900 samples, and for each power sample 2 watts
are always applied. The transient temperature stop increasing after 820
samples, while there is still about 5 degree difference between transient
and steady state temperature. I never have this experience when I was
using HotSpot without secondary path. Could you please advise me what
might be the problem?

Thank you,
Yen-Kuan Wu
Ph.D. Student
Department of Electrical and Computer Engineering
University of California, San Diego