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Photodetector test chip in SiGe technology. The design consists of three major parts:
Photo-receiver amplifier test circuits (Amit Gupta),
Photo-detectors in SiGe test devices (Leo Selavo), and
Multi-Channel Differential Encoding test circuits (Jason Bakos).
Designed by: Amit Gupta, Leo Selavo, and Jason Bakos
Technology: IBM 5HP SiGe
Size: 4mm x 4mm
Year: 2003
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Optoelectronic switch chip in Silicon on Saphire technology.
Designed by: Jason Bakos and Donald M. Chiarulli
Technology: SOS
Size: 4mm x 5mm
Year: 2002
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Sixteen versions of photo-detector and photo-receiver test devices and circuits in Silicon.
Designed by: Jose Martinez, Jeremiah Cessna, and Leo Selavo
Technology: SiCMOS
Size: 2mm x 2mm
Year: 2001
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Optically re-configurable Field Programmable Gate Array (OFPGA).
Designed by: Leo Selavo
Technology: 1.2um SiCMOS
Size: 4.6mm x 4.7mm
Year: 1999
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SS ALU Chip. CMOS chips flip-chip bonded to GaAs detectors and modulators.
Designed by: Nauromon Wattanapongsakorn, Raju Menon
Technology:
Size: 2mm x 2mm
Year: 1998
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Optical 4:1 Mux Chip. It used FET SEED detectors and modulators,
and was done as part of the first ATT/ARPA CO-OP run.
Designed by: Steven P. Levitan
Technology: GaAs
Size: 2mm x 2mm
Year: 1993
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