Chips created and tested at Pitt CS

The following chips have been designed, implemented and tested at the Optics Lab of the Department of Computer Science of the University of Pittsburgh

Two groups have participated in the design and testing: Computer Architecture group led by Dr.Donald M. Chiarulli, and Optical CAD group led by Dr. Steven P. Levitan.

Photodetector test chip in SiGe technology. The design consists of three major parts: Photo-receiver amplifier test circuits (Amit Gupta), Photo-detectors in SiGe test devices (Leo Selavo), and Multi-Channel Differential Encoding test circuits (Jason Bakos).

Designed by: Amit Gupta, Leo Selavo, and Jason Bakos
Technology: IBM 5HP SiGe
Size: 4mm x 4mm
Year: 2003

Optoelectronic switch chip in Silicon on Saphire technology.

Designed by: Jason Bakos and Donald M. Chiarulli
Technology: SOS
Size: 4mm x 5mm
Year: 2002

Sixteen versions of photo-detector and photo-receiver test devices and circuits in Silicon.

Designed by: Jose Martinez, Jeremiah Cessna, and Leo Selavo
Technology: SiCMOS
Size: 2mm x 2mm
Year: 2001

Optically re-configurable Field Programmable Gate Array (OFPGA).

Designed by: Leo Selavo
Technology: 1.2um SiCMOS
Size: 4.6mm x 4.7mm
Year: 1999

SS ALU Chip. CMOS chips flip-chip bonded to GaAs detectors and modulators.

Designed by: Nauromon Wattanapongsakorn, Raju Menon
Technology:
Size: 2mm x 2mm
Year: 1998

Optical 4:1 Mux Chip. It used FET SEED detectors and modulators, and was done as part of the first ATT/ARPA CO-OP run.

Designed by: Steven P. Levitan
Technology: GaAs
Size: 2mm x 2mm
Year: 1993

All photos by Leo Selavo.