Difference between revisions of "HotSpot"

From Rodinia
Jump to: navigation, search
 
Line 7: Line 7:
 
HotSpot. For more details about HotSpot, please refer to the article:
 
HotSpot. For more details about HotSpot, please refer to the article:
  
W. Huang, S. Ghosh, S. Velusamy, K. Sankaranarayanan, K. Skadron, M. R. Stan,  
+
W. Huang, S. Ghosh, S. Velusamy, K. Sankaranarayanan, K. Skadron, M. R. Stan,  
Hotspot: A compact thermal modeling methodology for early-stage VLSI design., IEEE Transactions on VLSI Systems 14 (5) (2006) 501–513.
+
Hotspot: A compact thermal modeling methodology for early-stage VLSI design., IEEE Transactions on VLSI Systems 14 (5) (2006) 501–513.
 
+
*[[Downloads]]
+

Latest revision as of 17:30, 4 May 2009

HotSpot is a widely used tool to estimate processor temperature based on an architectural floorplan and simulated power measurements. The thermal simulation iteratively solves a series of differential equations for block. Each output cell in the computational grid represents the average temperature value of the corresponding area of the chip. Our CUDA implementation re-implements the transient thermal differential equation solver from HotSpot. For more details about HotSpot, please refer to the article:

W. Huang, S. Ghosh, S. Velusamy, K. Sankaranarayanan, K. Skadron, M. R. Stan, Hotspot: A compact thermal modeling methodology for early-stage VLSI design., IEEE Transactions on VLSI Systems 14 (5) (2006) 501–513.