Advance Program

2:00-2:50 Welcome and Keynote Presentation

• Smart Chip, System and Data Center: Dynamic Provisioning of Power and Cooling from Chip Core to the Cooling Tower
     (slides, pdf)
     Chandrakant D. Patel, Distinguished Technologist, HP Labs

2:50-3:30 Empirical Results

• Event-Driven Thermal Management in SMP Systems, (pdf)
     (slides, pdf)
     A. Merkel, F. Bellosa, and A. Weissel, Univ. of Karlsruhe and Univ. of Erlangen
• TEAPC: Temperature Adaptive Computing in a Real PC (short paper)
     (slides, zip)
     A. K. Uht and R. J. Vaccaro, Univ. of Rhode Island

3:30-4:00 Break

4:00-5:05 Temperature-Aware Architecture

• Leveraging Simultaneous Multithreading for Adaptive Thermal Control
     (slides, pdf)
     J. Donald and M. Martonosi, Princeton Univ.
• A Preliminary Evaluation on Energy Efficiency of a Temperature-Aware Multicore-Processor (short paper)
     (slides, pdf)
     H. Sato and T. Sato, Seiko Epson Corp. and PRESTO Japanese Science and
     Technology Agency (JST)
• Temperature Aware Floorplanning
     (slides, pdf)
     Y. Han, I. Koren and C. A. Moritz, Univ. of Massachusetts-Amherst

5:05-6:00 Panel Discussion

• "What are the important research challenges in temperature-aware computer systems?"
   Panelists:
  • Pradip Bose, IBM TJ Watson Research Center
  • Antonio Gonzalez, Intel Barcelona Research Center and Univ. Politècnica de Catalunya, (slides, pdf)
  • Avi Mendelson, Intel Israel Microarchitecture Lab
  • Parthasarathy Ranganathan, Hewlett Packard Labs, (slides, pdf)
  • Anand Sivasubramanian, Pennsylvannia State Univ., (slides, pdf)
  • Josep Torrellas, Univ. of Illinois at Urbana-Champaign, (slides, pdf)